Universal Photonics, Inc.
FLP Microfinishing GmbHHall  3.1  - Stand  710
                                          - Machining- Ultraprecision machining
- Centring/rounding
- Polishing
- Grinding/lapping
- Sawing/cutting
 
- Auxiliary materials and tools for optics and optoelectronics- Lapping and grinding media
- Polishing agents
- Diamond pellets
- Adhesives, optical and glass
- Adhesives, UV curing
 
 
			UNICER 1000, CERIUM OXIDE POLISHING POWDER, GREATER PRODUCTIVITY
The latest addition to UNIVERSAL PHOTONICS’ extensive line of premium cerium oxide polishing powders, UNICER 1000, is engineered to service a wide range of applications where high quality surface finish and increased productivity are the ultimate goal. 
Its formula, the unique  ...more
 
			FLP Wafer 1300 - 1700 nano
The newly developed FLP Wafer 1300 - 1700 is a double-sided flat polishing machine for processing wafers and glass wafers. For the first time, chemically resistant granite polishing discs have been used. They guarantee a very high accuracy of the tool precision. The servo drives are  ...more

