Product novelty 14. April 2026

The IL400L is the first ultra-precision machine equipped with a femto-second laser for next-level glass, ceramic and silicon carbide machining. Various processes such as “Selective Laser Etching”, “Wafer Beveling” or “Face Side Structuring” can be executed. The laser is uniquely integrated into the machine controller to allow for quasi continuous surface energy input while running on ultra-precise polar kinematics. Advantages of the IL400L approach are the stand-still laser focus without Abbé influences, the on-center beam to easily correct for spherical abberations, the long working distance compared to scanners, and especially no need for stitching to address larger surfaces.

ILSLE
ILSLE introduces the selective laser etching process to an ultra-precision lathe for machining optics. To create a double-sided optic in fused silica, a laser focus is being guided on a tool path to inscribe the geometry in the bulk material of a cylinder. Writing from the back to the front, the entire geometry is written inside the glass. Due to the laser intensity in the focus spot the glass characteristics are modified in a way that subsequent etching is significantly accelerated in the regions of laser modification. The etching takes place selectively in such regions to extract the intended geometry. Front and backside are perfectly aligned as there is no need to swap the part as in grinding. The etching does not create any sub-surface damage, as there is no mechanical impact.

ILPAC
Alternatively, to the femto-second laser, the IL400L can be equipped with a diode laser to conduct hybrid laser assisted cutting of infrared and tungsten carbide materials. Our unique glass fiber coupling of the laser beam to the diamond allows for dynamic free form generating at lowest moving weight and highest stability of the optical system. The certified laser safety concept of the machine allows for a direct start of the technology in your production.